Thermally Conductive Silicone Sponge

Thermally Conductive Silicone Sponge

Product Model: zwxc-185
Density (g/cm³): 0
25% Compression Deformation Stress (KPa): 2±2
Tensile Strength (MPa): ≥0.2
Elongation at Break (%): ≥85
Compression Deformation at 100℃: ≤5.0
Water Absorption (%): ≤5.0
High-Low Temperature Brittle Test: -55℃-250℃ (Qualified)
Flame Resistance: UL94-V0
Environmental Testing: ROHS, REACH Compliant
Common Thickness (mm): 0.8-30
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Description
Technical Parameters
Products Description
 

 

 

Our thermally conductive silicone sponge is a highly versatile product, offering excellent thermal conductivity along with electrical isolation. This particular product is available in a variety of thicknesses from 0.8mm to 30mm. We can supply sheets with a width of 915mm in multiples of metre lengths. This ensures that you always get the perfect product to match your needs.

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Using a sponge rubber ensures that our product is able to conform to even the most uneven surfaces. This ensures that our thermally conductive silicone sponge provides excellent sealing properties at all times. The material is made up of a closed cell structure. Closed cell structures prevent liquid and gas from being able to penetrate through the material. This ensures that our product is an extremely effective gap filler.

The highly versatile nature of this product enables it to fill the needs of an unsupported thermal transfer material. It is also effective for use in applications which require clean release, enhanced thermal performance by filling air gaps, electrical isolation and vibration cushioning.

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Product Parameters
 

 

Liquid Silicone Foam Hardness Product model Density (g/cm³) 25% Compression deformation stress (KPa) Tensile strength (MPa) Fracture elongation rate (%) Compression deformation at 100℃ Water absorption rate (%) High and low-temperature embrittlement Flame retardancy Environmental protection testing Common thickness (mm) Classic application scenarios
Soft zwxc-185 0 2±2 ≥0.2 ≥85 ≤5.0 ≤5.0 Passes -55°C to 250°C UL94﹣V0 ROHS, REACH Compliant 0.8-30 Sealing support
Soft zwxc-186 0.16±0.05 10±3 ≥0.2 ≥85 ≤5.0 ≤5.0 Passes -55°C to 250°C UL94﹣V0 ROHS, REACH Compliant 0.8-30 Sealing support
Medium-hard zwxc-187 0.2±0.05 20±5 ≥0.3 ≥90 ≤5.0 ≤5.0 Passes -55°C to 250°C UL94﹣V0 ROHS, REACH Compliant 0.8-30 Sealing support
Hard zwxc-188 0.35±0.05 30±5 ≥0.3 ≥90 ≤5.0 ≤5.0 Passes -55°C to 250°C UL94﹣V0 ROHS, REACH Compliant 0.8-30 Sealing support

 

 

 

Advantages of Rolifyx Silicone
 
 

Temperature Resilience and Lightweight Design

The product excels in temperature resilience, withstanding extremes from -50°C to +250°C. Its low density and lightweight design contribute to ease of handling and application versatility.

 

Fine and Uniform Pore Structure

The sponge's intricate and uniform pore structure allows it to conform seamlessly to uneven surfaces. This ensures excellent sealing properties, making it an effective gap filler for various applications.

 

Multi-Functional Performance

Waterproof and Fire-resistant: Guarantees protection in diverse environments.

 

Shock Absorption

Provides effective vibration cushioning.
Insulation and Sealing: Ensures electrical isolation and efficient sealing.

 

Heat Insulation

Ideal for applications requiring thermal management by filling air gaps.

 

Long-Term Durability

Crafted with a closed-cell structure, the product exhibits long-term durability, preventing the penetration of liquids and gases. This ensures sustained effectiveness as a reliable gap filler over time.

 

 

 

FAQ

 
 

Q: Is silicone a good thermal conductor?

A: Absolutely! Our thermally conductive silicone sponge, as highlighted by its product characteristics and parameters, is engineered to be an excellent thermal conductor. With superior thermal conductivity properties, it ensures efficient heat transfer in a wide range of temperatures, ranging from -50°C to +250°C. The closed-cell structure of the silicone sponge enhances its thermal performance, making it an ideal choice for applications where effective thermal conduction is paramount. Trust in the prowess of our silicone sponge to deliver unparalleled thermal conductivity for your diverse needs.

Q: What is the difference between silicone and non silicone thermal pads?

A: Unlock the Power of Thermal Management: Silicone vs. Non-Silicone Thermal Pads
In the realm of thermal conductivity, our silicone-based sponge stands out as a game-changer. But how does it differ from non-silicone thermal pads? Let's delve into the distinction.
1. Temperature Resilience:
Silicone: Our silicone sponge thrives in extreme temperatures, from a chilling -50°C to a scorching +250°C, ensuring consistent performance in harsh conditions.
Non-Silicone: While non-silicone pads may exhibit thermal conductivity, they might not match the broad temperature range and resilience of our silicone solution.
 
2. Density and Weight:
Silicone: Boasting a low-density, lightweight design, our silicone sponge offers easy handling without compromising performance.
Non-Silicone: Non-silicone thermal pads may vary in density, potentially impacting their ease of use and versatility.
 
3. Conformity and Sealing:
Silicone: The sponge's closed-cell structure enables it to conform seamlessly to uneven surfaces, providing excellent sealing properties as an effective gap filler.
Non-Silicone: The conforming ability of non-silicone pads might be limited, affecting their effectiveness in sealing applications.
 
4. Multi-Functional Performance:
Silicone: Beyond thermal conductivity, our product excels in waterproofing, fire resistance, shock absorption, insulation, and heat insulation.
Non-Silicone: Non-silicone pads may offer thermal conductivity but might lack the diverse functionality our silicone sponge provides.
 
5. Long-Term Durability:
Silicone: Crafted for longevity, the closed-cell structure prevents the infiltration of liquids and gases, ensuring sustained effectiveness over time.
Non-Silicone: Durability of non-silicone pads may be influenced by their composition, potentially impacting long-term performance.

 

 

 

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